Technology |
Non-invasive MS-DWS |
---|---|
Wavelength |
650 nm |
Applied thickness |
μm – mm |
Temperature range |
RT – 250 °C |
Humidity range |
up to 80% |
Measurement time |
Minutes to Days |
Substrates |
Glass, Metal, Ceramic, Polymer… |
Sample Nature |
Liquid, Solid |
Dimensions |
585 x 704 x 434 mm |
Weight |
55 Kg |
CURINSCAN
Optimize Formulation & Curing Process,
CurinScan allows the monitoring of nanoscale mobility during the curing and drying process. Thanks to the Nanosacle Mobility Analysis (NMA), it identifies the drying & curing mechanisms (evaporation, packing, hardening…) and the characteristic times (Open time, dry-surface, drythrough…). The measurement is in-situ, contactless and works on any type of substrate (glass, metalic, paper, wood…) from RT up to 250 °C.
Additional information