CURINSCAN

Optimize Formulation & Curing Process,

CurinScan allows the monitoring of nanoscale mobility during the curing and drying process. Thanks to the Nanosacle Mobility Analysis (NMA), it identifies the drying & curing mechanisms (evaporation, packing, hardening…) and the characteristic times (Open time, dry-surface, drythrough…). The measurement is in-situ, contactless and works on any type of substrate (glass, metalic, paper, wood…) from RT up to 250 °C.

Additional information
Technology

Non-invasive MS-DWS

Wavelength

650 nm

Applied thickness

μm – mm

Temperature range

RT – 250 °C

Humidity range

up to 80%

Measurement time

Minutes to Days

Substrates

Glass, Metal, Ceramic, Polymer…

Sample Nature

Liquid, Solid

Dimensions

585 x 704 x 434 mm

Weight

55 Kg

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